The 3D microwave millimeter wave module adopts the original 3D microwave millimeter wave integrated technology and process implementation method, making the product light, small and thin, with a volume of only 1/4 of the traditional product or even smaller. It creatively solves the problem that RF circuit board signals can only be transmitted in one-dimensional plane. It can not only transmit in one dimension, but also transmit in cross-multi-dimension and multi-layer. Independent circuit units can be stacked and interconnected vertically. The packaged and integrated micro 3D modules can continue to be used as components and designed and assembled into more complex circuit systems. The problem that traditional circuit modules must be interconnected by cables and connectors is solved, and cables and connectors are eliminated. Therefore, the volume and weight of the product are significantly reduced, and the integration of the product is greatly improved.