The project "Micro Ultra-Wideband Frequency Synthesizer and Its 3D Integration Technology" was selected into the national 2023 "Huiyan (Sharp Eye) Action" program and has successfully completed acceptance. The 3D microwave/millimeter-wave modules developed in this project are extremely small in size and offer significant advantages. A number of products have been adopted in operational equipment and have received high recognition from users.
The core research achievements—3D microwave/millimeter-wave integration technology and its associated process implementation methods—have creatively solved the problem that signals on microwave/millimeter-wave circuit boards could only be transmitted in a one-dimensional plane. With this technology, RF circuit board signals can not only be transmitted in a single dimension, but also in crossed multi‑dimensions and multiple layers. Independent circuit units can be stacked and vertically interconnected.
Compared with traditional products, products using 3D microwave/millimeter-wave integration technology have the following advantages and characteristics:
(1) Traditional products generally use box‑type cavity isolation and screws to fasten printed circuit boards, resulting in a large and heavy metal housing;
(2) Traditional products typically use either a single reflow soldering process or a single micro‑assembly process, and cannot achieve compound integration;
(3) Inside traditional products, active circuits can only perform one‑dimensional planar transmission—they cannot cross, and transmission between different planes is not possible. If crossing or transmission across different planes is required, flying wires and cable connectors must be used, leading to a large volume;
(4) Similarly, between traditional modules, only one‑dimensional planar transmission is possible, without stacking or integration. If stacking or vertical interconnection is needed, cable connectors must be used, making the volume bulky and heavy.
Compared with traditional products, the frequency sources, transceiver modules, digital TR modules, and power amplifier modules designed with 3D microwave/millimeter-wave integration technology have an extremely small volume—only one‑quarter that of traditional products—and offer tremendous performance advantages. They can be widely used in satellite communications, drones (UAVs), radar, electronic countermeasures, and other civil and defense informationization equipment.
The project "Micro Ultra-Wideband Frequency Synthesizer and Its 3D Integration Technology" was selected into the national 2023 "Huiyan (Sharp Eye) Action" program and has successfully completed acceptance. The 3D microwave/millimeter-wave modules developed in this project are extremely small in size and offer significant advantages. A number of products have been adopted in operational equipment and have received high recognition from users.
The core research achievements—3D microwave/millimeter-wave integration technology and its associated process implementation methods—have creatively solved the problem that signals on microwave/millimeter-wave circuit boards could only be transmitted in a one-dimensional plane. With this technology, RF circuit board signals can not only be transmitted in a single dimension, but also in crossed multi‑dimensions and multiple layers. Independent circuit units can be stacked and vertically interconnected.
Compared with traditional products, products using 3D microwave/millimeter-wave integration technology have the following advantages and characteristics:
(1) Traditional products generally use box‑type cavity isolation and screws to fasten printed circuit boards, resulting in a large and heavy metal housing;
(2) Traditional products typically use either a single reflow soldering process or a single micro‑assembly process, and cannot achieve compound integration;
(3) Inside traditional products, active circuits can only perform one‑dimensional planar transmission—they cannot cross, and transmission between different planes is not possible. If crossing or transmission across different planes is required, flying wires and cable connectors must be used, leading to a large volume;
(4) Similarly, between traditional modules, only one‑dimensional planar transmission is possible, without stacking or integration. If stacking or vertical interconnection is needed, cable connectors must be used, making the volume bulky and heavy.
Compared with traditional products, the frequency sources, transceiver modules, digital TR modules, and power amplifier modules designed with 3D microwave/millimeter-wave integration technology have an extremely small volume—only one‑quarter that of traditional products—and offer tremendous performance advantages. They can be widely used in satellite communications, drones (UAVs), radar, electronic countermeasures, and other civil and defense informationization equipment.
